Apr 23, 2020 23:52
4 yrs ago
10 viewers *
English term
China
chip placement
English to Chinese
Tech/Engineering
IT (Information Technology)
deep learning
In “Chip Placement with Deep Reinforcement Learning”, we pose chip placement as a reinforcement learning (RL) problem, where we train an agent (i.e, an RL policy) to optimize the quality of chip placements.
芯片界的专业说法是“芯片放置”吗？
网上查，似乎“芯片贴装”更常见。
芯片界的专业说法是“芯片放置”吗？
网上查，似乎“芯片贴装”更常见。
Proposed translations
(Chinese)
| 4 | 晶片佈局 放置(的位置) |
brunoccj
|
| 4 | 芯片置入 |
Randy Wong
|
Proposed translations
7 days
Selected
晶片佈局 放置(的位置)
XXX
4 KudoZ points awarded for this answer.
Comment: "谢谢！"
43 mins
Randy Wong
China
China
Native in Chinese
Works in field
China
EN to CN? You're in good hands！
Native in: Chinese (Variant: Mandarin) 
Works in: English to Chinese, Chinese to English
Related KudoZ points
:
524
芯片置入
“贴装”是“封装”工艺的一种。
“封装”的固定说法是 Chip on board (COB) ；
关于该定义的具体说明：
Chip on board (COB) is the method of manufacturing where integrated circuits are wired and bonded directly to a printed circuit board. By eliminating the packaging of individual semiconductor devices, the completed product can be more compact, lighter, and less costly. In some cases chip on board construction improves the operation of radio frequency systems by reducing the inductance and capacitance of integrated circuit leads. Chip on board effectively merges two levels of electronic packaging, level 1 (components) and level 2 (wiring boards), and may be referred to as a "level 1.5"
“封装”的固定说法是 Chip on board (COB) ；
关于该定义的具体说明：
Chip on board (COB) is the method of manufacturing where integrated circuits are wired and bonded directly to a printed circuit board. By eliminating the packaging of individual semiconductor devices, the completed product can be more compact, lighter, and less costly. In some cases chip on board construction improves the operation of radio frequency systems by reducing the inductance and capacitance of integrated circuit leads. Chip on board effectively merges two levels of electronic packaging, level 1 (components) and level 2 (wiring boards), and may be referred to as a "level 1.5"
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